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YAXUN 535 Pasted IC Remover Liquid

550.00

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Applicable to softening and removing the mobile phone BGA IC chips and main board resin sealants. This product use new Eco-friendly that can rapidly soften and loosen the cured phenolic aldehyde,epoxy,acrylic,polyurethane,silicone resin sealants. It causes no damage to mobile phone circuit boards or elements.

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48
189,245.00

Cart

Quantity 150.00
Quantity 700.00
Quantity 2,100.00
Quantity 1,900.00
Quantity 250.00
Quantity 7,200.00
Quantity 600.00
Quantity 1,800.00
Quantity 1,200.00
Quantity 550.00
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