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56
244,074.00

Cart

Quantity 22,000.00
Quantity 2,600.00
Quantity 200.00
Quantity 2,000.00
Quantity 250.00
Quantity 250.00
Quantity 155.00
Quantity 100.00
Quantity 11,300.00
Quantity 600.00
Quantity 200.00
Quantity 150.00
Quantity 200.00

YAXUN 535 Pasted IC Remover Liquid

550.00

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Applicable to softening and removing the mobile phone BGA IC chips and main board resin sealants. This product use new Eco-friendly that can rapidly soften and loosen the cured phenolic aldehyde,epoxy,acrylic,polyurethane,silicone resin sealants. It causes no damage to mobile phone circuit boards or elements.

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56
244,074.00

Cart

Quantity 22,000.00
Quantity 2,600.00
Quantity 200.00
Quantity 2,000.00
Quantity 250.00
Quantity 250.00
Quantity 155.00
Quantity 100.00
Quantity 11,300.00
Quantity 600.00
Quantity 200.00
Quantity 150.00
Quantity 200.00
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