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YAXUN 535 Pasted IC Remover Liquid
₹550.00
Applicable to softening and removing the mobile phone BGA IC chips and main board resin sealants. This product use new Eco-friendly that can rapidly soften and loosen the cured phenolic aldehyde,epoxy,acrylic,polyurethane,silicone resin sealants. It causes no damage to mobile phone circuit boards or elements.
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Liquid & Glue motor
CJ7+ Electric OCA Glue Motor
₹850.00Add to cartCJ7+ USB Electric Adhesive Removal Rod LCD Screen Shovel Glue Tool Mobile Phone Remove OCA Glue This product is highly efficient and saving where it can be used to remove the adhesive on the LCD / OLED display by using the way of rolling the adhesive on display. After removing …
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