Cart

Your Cart is Empty

Back To Shop

YAXUN 535 Pasted IC Remover Liquid

550.00

Ask for help

Applicable to softening and removing the mobile phone BGA IC chips and main board resin sealants. This product use new Eco-friendly that can rapidly soften and loosen the cured phenolic aldehyde,epoxy,acrylic,polyurethane,silicone resin sealants. It causes no damage to mobile phone circuit boards or elements.

Brand

Other

Reviews

There are no reviews yet.

Be the first to review “YAXUN 535 Pasted IC Remover Liquid”

Your email address will not be published. Required fields are marked *

Change Language

Cart

Your Cart is Empty

Back To Shop
Scan the code