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YAXUN 535 Pasted IC Remover Liquid
₹550.00
Applicable to softening and removing the mobile phone BGA IC chips and main board resin sealants. This product use new Eco-friendly that can rapidly soften and loosen the cured phenolic aldehyde,epoxy,acrylic,polyurethane,silicone resin sealants. It causes no damage to mobile phone circuit boards or elements.
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WL 800 Mini Hand Drill Small Electric Grinding Suit
₹1,400.00Add to cartWL 800 Mini Hand Drill Small Electric Grinding Suit Revolving speed: 5000 – 18000RPM 5 x DrillPacking List: s (0.5mm 1.0mm 1.5mm 2.5mm 3.0mm) 5 x Chucks (0.5mm 1.0mm 1.5mm 2.5mm 3.0mm) 1 x Brush 1 x Alloy file (3×140) 1 x Drill handle (cable length 90cm) 1 x …
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