YAXUN 535 Pasted IC Remover Liquid

550.00

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Description

Applicable to softening and removing the mobile phone BGA IC chips and main boardĀ resin sealants. This product use new Eco-friendly that can rapidly soften and loosen the cured phenolic aldehyde,epoxy,acrylic,polyurethane,silicone resin sealants. It causes no damage to mobile phone circuit boards or elements.

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