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Quick 858D SMD Digital Rework Station
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Liquid & Glue motor
CJ7+ Electric OCA Glue Motor
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YAXUN 535 Pasted IC Remover Liquid
₹550.00Add to cartApplicable to softening and removing the mobile phone BGA IC chips and main board resin sealants. This product use new Eco-friendly that can rapidly soften and loosen the cured phenolic aldehyde,epoxy,acrylic,polyurethane,silicone resin sealants. It causes no damage to mobile phone circuit boards or elements.
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