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Full HD 1080P 60FPS 2K 3800W 38MP Hdmi Video Microscope Camera
₹8,500.00₹6,800.00 - WLXY Precision knife ₹70.00
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MECHANIC MC75S-B1- Microscope With 0.5X Lens
₹13,500.00₹12,800.00 - 0.12MM STENCILS PLATES FOR IPHONE 6 / 6+ WITH CPU ( A8 ) ₹250.00
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MK-11 Bend Tweezer
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Liquid & Glue motor
YAXUN 535 Pasted IC Remover Liquid
₹550.00Add to cartApplicable to softening and removing the mobile phone BGA IC chips and main board resin sealants. This product use new Eco-friendly that can rapidly soften and loosen the cured phenolic aldehyde,epoxy,acrylic,polyurethane,silicone resin sealants. It causes no damage to mobile phone circuit boards or elements.
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