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Mechanic XGSP50 PPD
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Description
- use liquid flux if it is dry CONDITION
- This is one of the best inventions for home electronics builders
- Alloy: Sn63 / Pb37 | Microns: 25-45um
- Low melting – point. You may just dilute with liquid flux to make it flow better.
- It can also be used with small syringe to apply the solder to the PCB.
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Stencil
Mechanic iBGA 13 Max Middle Frame BGA Reballing Platform
₹2,100.00Add to cartMechanic iBGA 13 Max Middle Frame BGA Reballing Platform For iPhone X-13 Pro Max Motherboard Rework Tin Mesh Template Fixture Features: 1. Anti-leakage tin barrier design. 2. High temperature does not allow the drum. 3. Strong magnetic automatic positioning, precision positioning. 4. Integrated, removable tin planting. 5. Positioning slot of …
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Paste
Mechanic iSm3 Jump wire Specific Paste 138°C
₹350.00Add to cartMECHANIC ISM3 SPECIAL SOLDER PASTE FOR PHONE JUMPER WIRE Specification: iSm3 Mechanic Jump Wire Special paste with 3pcs Needle/iSm3 Mechanic Jump Wire Special paste with 3pcs Needle volume: 3ML temperature: 183 ℃/138℃ easy to tin, high activity, Flying line on the touch, tin point full
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