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Mechanic iBGA 13 Max Middle Frame BGA Reballing Platform
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Mechanic iBGA 13 Max Middle Frame BGA Reballing Platform For iPhone X-13 Pro Max Motherboard Rework Tin Mesh Template Fixture
Features:
1. Anti-leakage tin barrier design.
2. High temperature does not allow the drum.
3. Strong magnetic automatic positioning, precision positioning.
4. Integrated, removable tin planting.
5. Positioning slot of the double-sided motherboard.
6. For iPhone 13/13mini/13 Pro/13 Pro Max.
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Fixture & Pcb Stand
Mechanic NP6 Mobile Phone Glass Back Cover Fixing Fixture
₹2,200.00Add to cartFeatures: Efficient and quick removal of the back cover, suitable for mobile phones with back cover glass, etc Black clamps can clamp motherboards or chips with a width of less than 44mm; blue clamps can clamp motherboards or chips with a width of less than 44mm; meet the size of …
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Paste
Mechanic iSm3 Jump wire Specific Paste 138°C
₹350.00Add to cartMECHANIC ISM3 SPECIAL SOLDER PASTE FOR PHONE JUMPER WIRE Specification: iSm3 Mechanic Jump Wire Special paste with 3pcs Needle/iSm3 Mechanic Jump Wire Special paste with 3pcs Needle volume: 3ML temperature: 183 ℃/138℃ easy to tin, high activity, Flying line on the touch, tin point full
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