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TOP RATED PRODUCTS
MECHANIC 0.02MM PURE COPPER JUMPER WIRE WITH BIT
₹450.00
MECHANIC 0.02MM PURE COPPER JUMP WIRE FLY LINE REPAIR TOOL FOR PHONE MOTHERBOARD LOGIC BOARD PCB
The wire is small and easy to be straightened, and the diameter is around 0.02 mm.
It can also be straightened to smaller, which is suitable for repairing fingerprint and other small soldering point.
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Fixture & Pcb Stand
Mechanic MRX Logicboard CPU NAND Repair PCB Holder
₹1,600.00Add to cartMechanic MRX Logicboard CPU NAND Repair PCB Holder for iPhone X,XS,XS Max,XR & A11/A12 Motherboard PCB fixture, CPU NAND PCIE glue remove, fingerprint repair fxture Multi-Function in one Motherboard PCB fixture, CPU NAND PCIE glue remove, fingerprint repair fxture Multi-Function in one PCB repair platform added CPU positioning structure. No …
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Paste
Mechanic iSm3 Jump wire Specific Paste 138°C
₹350.00Add to cartMECHANIC ISM3 SPECIAL SOLDER PASTE FOR PHONE JUMPER WIRE Specification: iSm3 Mechanic Jump Wire Special paste with 3pcs Needle/iSm3 Mechanic Jump Wire Special paste with 3pcs Needle volume: 3ML temperature: 183 ℃/138℃ easy to tin, high activity, Flying line on the touch, tin point full
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Paste
Mechanic XGSP50 PPD
Sale!₹250.00₹200.00Add to cartDescription use liquid flux if it is dry CONDITION This is one of the best inventions for home electronics builders Alloy: Sn63 / Pb37 | Microns: 25-45um Low melting – point. You may just dilute with liquid flux to make it flow better. It can also be used with small …
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Stencil
Mechanic iBGA 13 Max Middle Frame BGA Reballing Platform
₹2,100.00Add to cartMechanic iBGA 13 Max Middle Frame BGA Reballing Platform For iPhone X-13 Pro Max Motherboard Rework Tin Mesh Template Fixture Features: 1. Anti-leakage tin barrier design. 2. High temperature does not allow the drum. 3. Strong magnetic automatic positioning, precision positioning. 4. Integrated, removable tin planting. 5. Positioning slot of …
Mechanic iBGA 13 Max Middle Frame BGA Reballing PlatformRead More
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